AR
C
HIVE INF
O
RMATI
O
N
A
RCHIVE INFORMATION
MRF18060ALR3 MRF18060ALSR3
11
RF Device Data
Freescale Semiconductor
PACKAGE DIMENSIONS
CASE 465--06
ISSUE G
NI--780
MRF18060ALR3
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M--1994.
2. CONTROLLING DIMENSION: INCH.
3. DELETED
4. DIMENSION H IS MEASURED 0.030 (0.762) AWAY
FROM PACKAGE BODY.
DIM MIN MAX MIN MAX
MILLIMETERS
INCHES
A
1.335 1.345 33.91 34.16
B
0.380 0.390 9.65 9.91
C
0.125 0.170 3.18 4.32
D
0.495 0.505 12.57 12.83
E
0.035 0.045 0.89 1.14
F
0.003 0.006 0.08 0.15
G
1.100 BSC 27.94 BSC
H
0.057 0.067 1.45 1.70
K
0.170 0.210 4.32 5.33
N
0.772 0.788 19.60 20.00
Q
.118 .138 3.00 3.51
R
0.365 0.375 9.27 9.53
STYLE 1:
PIN 1. DRAIN
2. GATE
3. SOURCE
1
3
2
D
G
K
C
E
H
S
(INSULATOR)
F
S
0.365 0.375 9.27 9.52
M
0.774 0.786 19.66 19.96
aaa
0.005 REF 0.127 REF
bbb
0.010 REF 0.254 REF
ccc
0.015 REF 0.381 REF
Q
2X
bbb BT
A
M
M
M
bbb BT
A
M
M
M
B
B
(FLANGE)
T
SEATINGPLANE
ccc BT
A
M
M
M
bbb BT
A
M
M
M
AA
(FLANGE)
N
(LID)
M
(INSULATOR)
aaa BT
A
M
M
M
R
(LID)
ccc BT
A
M
M
M
CASE 465A--06
ISSUE H
NI--780S
MRF18060ALSR3
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M--1994.
2. CONTROLLING DIMENSION: INCH.
3. DELETED
4. DIMENSION H IS MEASURED 0.030 (0.762) AWAY
FROM PACKAGE BODY.
DIM MIN MAX MIN MAX
MILLIMETERS
INCHES
A
0.805 0.815 20.45 20.70
B
0.380 0.390 9.65 9.91
C
0.125 0.170 3.18 4.32
D
0.495 0.505 12.57 12.83
E
0.035 0.045 0.89 1.14
F
0.003 0.006 0.08 0.15
H
0.057 0.067 1.45 1.70
K
0.170 0.210 4.32 5.33
M
0.774 0.786 19.61 20.02
R
0.365 0.375 9.27 9.53
STYLE 1:
PIN 1. DRAIN
2. GATE
5. SOURCE
1
2
D
2X
K
C
E
H
F
3
4X
U
(FLANGE)
4X
Z
(LID)
bbb
0.010 REF 0.254 REF
ccc
0.015 REF 0.381 REF
aaa
0.005 REF 0.127 REF
S
0.365 0.375 9.27 9.52
N
0.772 0.788 19.61 20.02
U
-- -- -- 0 . 0 4 0 -- -- -- 1 . 0 2
Z
-- -- -- 0 . 0 3 0 -- -- -- 0 . 7 6
bbb BT
A
M
M
M
B
B
(FLANGE)
T
SEATING
PLANE
ccc BT
A
M
M
M
bbb BT
A
M
M
M
A
A
(FLANGE)
N
(LID)
M
(INSULATOR)
ccc BT
A
M
M
M
aaa BT
A
M
M
M
R
(LID)
S
(INSULATOR)
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